In response to growing demand in the semiconductor industry, Dow Corning’s Electronics Division announced on February 19 in Michigan that it plans to more than double its silicone production capacity. This move is aimed at supporting the development of advanced photolithography materials, particularly novel bilayer resists used in semiconductor manufacturing.
The expansion of Dow Corning’s silicone rubber production will enable more semiconductor manufacturers to benefit from the use of bilayer photoresists. Jeff Bremmer, Dow Corning’s global program manager for silicon lithography, emphasized that along with this expansion, the company is also accelerating the adoption of silicon-based materials in lithography technologies.
Photoresists are light-sensitive materials that undergo chemical changes when exposed to specific wavelengths of light or radiation. This allows them to be selectively removed during etching processes. By combining silicone with light-sensitive components, Dow Corning is offering chip manufacturers a thinner and more precise photoresist layer, which is essential for next-generation semiconductor fabrication.
Since 2004, Dow Corning has been collaborating with photolithography material suppliers to develop silicone-based photoresists. In December 2006, the company partnered with a Japanese firm to create a bilayer photoresist. This product uses Dow Corning’s proprietary silicone resin in the imaging layer, providing superior etching selectivity for 193 nm photolithography processes. The two companies revealed last December that this bilayer resist is now being supplied to a leading global memory chip manufacturer, marking a significant milestone in the industry.
This expansion not only strengthens Dow Corning’s position in the market but also supports the ongoing trend toward smaller, more efficient chips, driving innovation across the electronics sector.
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